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Background Over the past several years,
the semiconductor industry has realized a number of requirements
to achieve greater efficiency for manufacturing future technology.
The most visible of these is to reduce the cost per cm2 of silicon
produced. This has translated into an industry-wide effort enabling
the production of 300mm wafers. 300mm Solutions SDI is able to implement the 300mm scenarios on top of existing GWGEM (tm), sdiStation (tm), and CIMConnect (tm) platforms. SDI uses fully off-the-shelf proven software components for the entire implementation. The software in Windows NT native and ActiveX/COM based. Each 300mm Scenario (e.g. E-87) comes in the form of an off-the-shelf COM object that can be implemented stand-alone or in conjunction with other 300mm Scenarios. Already today, five 300mm semiconductor equipment models use the SDI solution. SDI uses the proven CIMConnect product (formerly known as sdiStation Equipment Developer) and the new CIM300 product to implement the SECS/GEM and 300mm Scenarios. The end result is a fully working SECS/GEM and 300mm ready platform for prompt delivery from the equipment suppliers to the customers. In addition, each 300mm module comes with a 36 months maintenance agreement that will automatically provide the customer with updates and keep up with changes and modifications to the 300mm standards. Benefits
![]() 300mm SECS Interface Scenarios |